Hong Kong Innovation Node
Hong Kong
MIT DesignX partnered on a two-week intensive summer program in Hong Kong in 2023, with continued curriculum support in 2024. Bringing together 50 students from seven Hong Kong universities and MIT, the program organized participants into ten teams and challenged them to address real-world issues at the intersection of urban design, transportation, and placemaking, developing startup ideas to tackle the problems they identified.
A customized MIT DesignX curriculum ran across the full two weeks, with different modules delivered each day alongside site visits and collaborative group work. Teams concluded the program with final presentations and received academic credit through their Hong Kong institutions.